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Thermal Compounds, Pastes, Greases for Electronics

Momentive's thermally conductive SilCool grease compounds offer excellent thermal conductivity, as well as excellent stability, penetration, temperature resistance, and low bleed. These properties enable SilCool grease compounds to draw heat away from devices, contributing to improved reliability and operational efficiency of electronic components.

The combination of processing performance and thermal conductivity that these grease compounds offer makes them good candidates for thermal interface applications in a wide range of high-performance devices and packages.

SilCool Thermally Conductive Silicone Grease Compounds

Momentive’s family of SilCool series silicone grease compounds feature outstanding thermally conductive and dielectric properties, excellent workability, virtually no oil separation, and minimal weight loss at elevated temperatures. These high-performance grease products can help address the heat management challenges that result from higher frequencies, higher power, and miniaturization in the development of electric and electronic devices.

Key Features of Momentive's Silcool Silicone Grease Compounds

  • Minimal ionic impurities & excellent dielectric properties
  • Highly workablility – to help meet the demands of automated dispensing, screen printing, and stamping applications
  • High thermal conductivity
  • Wide operating temperature range
  • Low oil separation and minimal weight loss at elevated temperatures

Product Details

Properties TIG830SP TIG400BX TIG300BX TIG210BX TIG2000 TIG1500 TIG1000
Features High thermal conductivity, low thermal resistance High thermal conductivity, low oil bleed, temperature resistance High thermal conductivity, low oil bleed, temperature resistance Low oil bleed, temperature resistance Grease with good thermal conductivity Temperature resistance grease General purpose thermal grease
Property / Color Gray Paste Gray Paste Gray Paste Gray Paste Pale Blue Paste White Paste White Paste
Thermal Conductivity1 W/m.K 4.1 4.0 3.0 2.1 2.0 1.6 1.0
Thermal Resistance2(BLT) mm2.K/W 12 (20μm) 17 (55μm) 20 (45μm) 20 (45μm) 26 (50μm) 35 (34μm) 33 (50μm)
Specific Gravity (23°C) 2.88 3.18 3.00 2.90 2.80 2.6 2.50
Penetration3(23°C) 360 260 350 345 400 275 340
Viscosity (23°C) Pa.s 300 350 250 250 130 110 -
Bleed3(150°C/24h) wt% 0.0* 0.0* 0.0* 0.0* 0.1 - 0.1
Evaporation (150°C/24h) wt% 0.3 0.3 0.1 0.1 0.1 - 0.1
Volume Resistivity4 MΩ.m - 3x103 5x103 1x106 1x106 7.7x106 3x106
Dielectric Strength kV/0.25mm - 5.0 5.0 3.0 5.0 2.8 -
Volatile Siloxane (D4-D10) ppm <100 <100 <100 <100 <100 <100 <100
Ionic Content5(Na+/K+/Cl-) ppm 0.5, 0.0, 0.1 0.05, 0.03, 0.3 1.0, 0.3, 0.3 2.0, 0.0, 0.0 - - -

1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material, 3JIS K 2220, 4MIL-S-8660B, 5Ion chromotography analysis on water extracts, *Measurement limit Typical properties are average data and are not to be used as or to develop specifications.

(Charts) Thermal Resistance is proportional to the thickness of the material through which the heat must travel. The ability to control and reduce thickness (BLT) of the thermal interface is a key factor in the component assembly process. Increases in assembly pressures are known to contribute to reductions in BLT, and subsequently, reduced thermal resistance.

thermal-grease-1-silcool-grease-initial-properties

thermal-grease-3-blt-vs-assembly-pressure

(Above) Test Conditions: Sandwich 0.02ml of material between 10mm×10mm silicon dies, and apply desired pressure for 1 minute. Measure BLT.

thermal-grease-2-thermal-shock-reliability

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, and apply 300kPa pressure. Thermal cycle (-55°C~125°C, dwell time 30 minutes at each extreme). Measure thermal resistance using laser flash method.

silcool-grease-4-high-temperature-aging

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies and apply 300kPa pressure. Expose to 150°C temperatures up to 1000 hours. Measure thermal resistance using laser flash method.

The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.

 

Featured Products

SilCool* TIG2000 Silicone Grease

SilCool* TIG2000 silicone thermal conductive grease can draw heat away from a range of electronic application components.

View Product Download Technical Data View Product Literature

SilCool* TIG210BX Silicone Compound

SilCool* TIG210BX silicone compound are used in electronics and other applications where high thermal conductivity and low oil bleed are required. Learn more.

View Product Download Technical Data View Product Literature
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.