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1-800-295-2392 or click below to call one of our regional representatives. Call Regional Customer Service Representative

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SilCool™ Thermal Interface Materials

In response to new heat-management challenges presented by higher frequencies and power,  and increased miniaturization of today’s electronic devices, Momentive scientists have developed and continue to enhance our SilCool thermal interface materials. The excellent thermal conductivity and consistent, long-term heat transfer performance provided by SilCool products can enable such devices to operate more efficiently and reliably. Our complete SilCool product portfolio, which includes grease compounds, adhesives, encapsulants and potting compounds, and liquid dispensed thermal pads, also offers excellent workability, thin bond lines and minimal weight loss at elevated temperatures.


Along with excellent thermal conductivity, SilCool grease compounds offer low bleed as well as great stability, penetration and temperature resistance. The combination of processing performance and thermal conductivity exhibited by these grease compounds, make them particularly attractive candidates for high-performance devices and packages.

Quick-curing SilCool silicone adhesive products can allow thin bond lines that will generally contribute to low thermal resistance, as well as provide excellent adhesion and reliability. They can adhere well to ceramics, glass and most metals (including aluminum, copper and nickel plate), without the use of primers, and without causing corrosion to most metal substrates. In addition, SilCool silicone adhesive products offer excellent adhesion to many high-performance thermoplastics, such as PPS and PBT.

SilCool silicone potting compounds, encapsulants and liquid dispensed thermal pads include a variety of heat and room temperature cure materials. Low-viscosity grades are available for potting applications, and moderate-viscosity grades can provide the necessary dispensing stability for bead formulation. Forming a stress-relieving rubber, these SilCool grades can also be considered for use as gap fillers or as liquid-dispensed alternatives to thermal pads.

The highly workable nature of SilCool products can help effectively accommodate automated dispensing, screen printing and stamping. SilCool silicone products are excellent candidates for electronic and other applications where thermal management and high-heat transfer are critical.

The SilCool brand of thermal interface materials is used across many industries, such as energy, power, utilities, telecom, microelectronics, aerospace, automotive, renewable energy, consumer electronics and health care. Potential applications include assembly adhesion, board assembly and manufacturing of flat-panel monitors, photovoltaic components and hybrid car parts.

Discover how products in the versatile SilCool brand can meet thermal management objectives.


* SilCool is a trademark of Momentive Performance Materials Inc.


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SILCOOL™ TIA208RL Thermally Conductive Silicone Potting

SILCOOL TIA208RL is a two-component, thermally conductive material for potting. The flowability of TIA208RL allows it to be potted and conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat. TIA208RL can be cured at room temperature or quickly with heat.

SILCOOL™ TIA219R / TIA219RP Thermally Conductive Silicone Potting Materials with Adhesion

SILCOOL™ TIA219R and TIA219RP thermal potting silicones are two-component, thermally conductive materials typically used for potting and gap filling. When cured at room temperature or quickly with heat, they cure to a thermally conductive rubber and adhere well to various types of materials such as metals, plastics, glass and ceramics, without the use of primers. TIA219RP is the prolonged pot life version of TIA219R.

SILCOOL™ TIA225GFB-25 Liquid-Dispensed Thermal PAD/Gap Filler

SILCOOL TIA225GFB-25 gap filler is a 2-component, soft, thermally conductive silicone material that can help to dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for better optimized processing. TIA225GFB-25 gap filler can be used as liquid-dispensed alternative to pre-fabricated thermal pads, for a broad array of thermal designs in electronic applications.

SilCool™ TIA241GF Silicone Gap FIller

Learn more about SilCool* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

SilCool™ TIA350R Adhesive

Learn more about SilCool TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

SilCool™ TIG210BX Silicone Compound

SilCool* TIG210BX silicone compound are used in electronics and other applications where high thermal conductivity and low oil bleed are required. Learn more.

SilCool™ XE13-C1862PT Thermally Conductive Silicone Adhesive

Learn more about SilCool XE13-C1862PT —quick-curing, one-part silicone adhesive and its use for heat-generating elements and regulators.

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.