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1-800-295-2392 or click below to call one of our regional representatives. Call Regional Customer Service Representative

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Ultra-High Thermal Gap Fillers

Faster processing speeds, more stringent performance requirements, and miniaturization in many electronic applications are some of the factors driving demand for new solutions to help meet thermal management challenges. Momentive’s SilCool* ultra-high thermally conductive gap fillers are liquid dispensed silicone materials available in thermal conductivities in the 8 ~ 10 W/m.K range. These high thermal conductivities can help solve heat dissipation challenges and provide designers of electronic components with greater design flexibility to achieve performance expectations.

 

 

Key Features and Typical Benefits

  •  High thermal conductivity
  • Electrically insulative properties
  • Dispensability (easy conformity to 3 dimensional PCB designs)
  • Softness, stress- absorption
  • Repairability
  • Resistance to cracking and sagging (when assembled in typical vertical positions)

Typical Physical Properties

Product Characteristics

unit

SilCool TIA2101GF gap filler

SilCool TIA182GF gap filler

Type

2 Component

1 Component

Thermal Conductivity(1)

W/m.K

10.1

8.2

Volume Resistivity

Ω.cm

3 x 1013

1 x 1012

Dielectric Strength

kV/mm

15

15

Low Volatile Siloxane (D4~D10)

ppm

<100

<100

Mixing Ratio

1:1

-

Cure Condition (at 23℃)

h

24

no cure required

Typical properties are average data and are not to be used as or to develop specifications.
1. 
Hot Disk method

* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.