Thermally Conductive Silicone Adhesives for Electronics Products

SILCOOL* TIA0220 neutral alkoxy cure adhesive offers high thermal conductivity and can cure without heat, making it an ideal candidate for a variety of electronic applications.

Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

Learn more about SILCOOL XE13-C1862PT —quick-curing, one-part silicone adhesive and its use for heat-generating elements and regulators.

SNAPSIL TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature

XE11-B5320 is a one-component, low volatile paste, alkoxy cure, thermally conductive silicone adhesive sealant.

TSE3280-G

TSE3281-G

TSE3282

TSE3320 Adhesive

TSE3843-W Adhesive