Thermally Conductive Silicone Adhesives for Electronics Products
SILCOOL* TIA0220 neutral alkoxy cure adhesive offers high thermal conductivity and can cure without heat, making it an ideal candidate for a variety of electronic applications.
Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.
Learn more about SILCOOL XE13-C1862PT —quick-curing, one-part silicone adhesive and its use for heat-generating elements and regulators.
SNAPSIL TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature
XE11-B5320 is a one-component, low volatile paste, alkoxy cure, thermally conductive silicone adhesive sealant.
New From Momentive
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
