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SilCool™ XE13-C1862PT Thermally Conductive Silicone Adhesive

QUICK CURING, STRONG ADHESION

Momentive's SilCool XE13-C1862PT thermally-conductive silicone adhesive cures quickly and adheres well to a variety of substrates. It is a one-component, heat-curable adhesive used for a variety of applications, and it can adhere to a range of substrates that include most  metals, plastics, ceramics and glass without the use of a primer.

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  • Technical Documents

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Thermal Management Silicones for Electronics Brochure
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More About SilCool™ XE13-C1862PT Thermally Conductive Silicone Adhesive

Key Features and Typical Benefits of SilCool* XE13-C1862PT Silicone Adhesive:

This one-component silicone adhesive product is an excellent candidate to consider for applications requiring  thermal conductivity, strong adhesion and noncorrosive performance.

  • Excellent thermal conductivity
  • Low viscosity
  • High elongation
  • Ready to use: one component
  • Quick cures for increased productivity
  • Heat accelerated cure
  • Excellent adhesive properties: Primerless adhesion to many types of substrates
  • Non corrosiveness to metals

 

 

Potential applications for SilCool XE13-C1862PT silicone adhesive include:

  • Heat-generating elements
  • Regulators
  • Rectifiers
  • Thyristors
  • Other sealing and bonding needs for thermally conductive applications

 

* SilCool is a trademark of Momentive Performance Materials Inc. 

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.