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SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

FOR HIGH THERMAL CONDUCTIVITY

SilCool TIA0220 is a one-part neutral alkoxy curing adhesive formulation with a high thermal conductivity level of 2.2 W/mK.

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  • Technical Documents

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Silicone Materials for Electronic Devices and Component Assemblies Brochure
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More About SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

Key features and typical benefits of SilCool TIA0220 Neutral Alkoxy Cure Adhesive

SilCool TIA0220 neutral alkoxy cure adhesive typically cures at room temperature.  It is an ideal candidate for applications that require a high level of thermal conductivity, yet cannot employ a heating process for curing. It offers non-corrosive adhesion to highly thermal and electrically conductive metals, such as copper. It is also broadly compatible with plastics, ceramics and glass. Review the typical benefits of SilCool TIA0220 below to see how it could benefit your next electrical project.

  • High thermal conductivity
  • Low volatility: reduced low molecular siloxane content
  • Non-corrosiveness to metals (including copper)
  • One-component, fast alkoxy cure
  • Primer-less adhesion to range of substrates, including metals (such as copper), plastics, ceramics, glass, etc.
  • Wide operating temperature range: -40 ºC ~ +150 °C

 

Potential applications for SilCool TIA0220 neutral alkoxy cure adhesive include:

  • Heat spreaders
  • Board-level component assembly

 

 

* SilCool is a trademark of Momentive Performance Materials Inc.

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.