Thermally Conductive Gap Fillers Products
SILCOOL TIA141GF is a dispensable, 1-component, pre-cured thermal gap filler. Its non-slump characteristics after dispense can provide physical stability to retain shape until assembly, and since it is a dispensable material, TIA141GF flows can conform to complex designs and non-uniform thicknesses of assemblies at minimized assembly pressures.
Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.
SILCOOL TIA268GF silicone is a 2-component, soft, thermally conductive material that can dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for optimized processing.
TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer
TIA222G Thermally Conductive Silicone
TIA222G thermally conductive silicone is a two-component material used for encapsulating, gap filling, and as a thermal path to heat sinks.
New From Momentive
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
