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SILCOOL™ TIA268GF Liquid-Dispensed Thermal Pad / Gap Filler
SILCOOL TIA268GF silicone is a 2-component, soft, thermally conductive material that can dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for optimized processing. It can be used as liquid dispensed alternative to pre-fabricated thermal pads, for a broad array of thermal designs in electronic applications.
More About SILCOOL™ TIA268GF Liquid-Dispensed Thermal Pad / Gap Filler
Key Features and Typical Benefits
- High thermal conductivity
- Fast, low temperature cure
- Convenient 1:1 mix ratio by weight
- Retains softness after cure to contribute to stress relief during thermal cycling
- Good slump resistance (stays in place)
- Repairable
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
