Momentive Performance Materials provides leading-edge silicone technologies to help meet performance and productivity challenges in a wide range of automotive and electronic applications. Momentive’s dielectric potting and encapsulation materials are principally used to protect electronic components from moisture and harmful contaminants. These materials can help provide stress relief protection to circuits from thermal, vibration, and mechanical stress. Momentive offers a range of materials including one- and two-part products and specialized grades that offer thermal conductivity, flame retardancy, and low volatiles.
|
Key Features
|
|
Typical Benefits
|
|
Potential Applications
|
Typical Physical Properties
(selected grades only; please contact us for material selection support)
| Product | System (1) | Ratio (w/w) | Cure Time | Color | Type | Viscosity (Pa·s) | Feature |
| TSE3051 | AC, 1K | n.a. | 1 hr @ 150 °C | Clear | Gel | 0.7 | 1 Part - Easy handling |
| TSE3070 | AC, 2K | 1:1 | 0.5 hr @ 70 °C | Clear | Gel | 0.8 | Excellent vibration damping |
| TSE3032 | AC, 2K | 10:1 | 1 hr @ 100 °C | Clear | Rubber | 4 | Non bonding |
| TSE3033 | AC, 2K | 1:1 | 30 min @ 150 °C | Clear | Rubber | 1 | Self bonding |
| TSE3331K | AC,2K | 1:1 | 1 hr @ 120 °C | Dark Grey | Rubber | 3 | UL94 - V0. Thermal conductive |
| TSE3251 | AC, 1K | n.a. | 1 hr @ 150 °C | White | Rubber | 8.5 | 1K - Easy handling |
| RTV11 | CC, 2K | Variable | 24 hr @ RT | White | Rubber | 11 | FDA compliant (2), deep section cure possible |
| TSE3660 | CC, 2K | 100:8 | 24 hr @ RT | Light blue | Rubber | 3 | Low temp adhesion, good deep sectioncure, UL-94 HB |
(1) AC = Addition Cure, CC = Condensation Cure
(2) Compositionally compliant with the requirements of 21 CFR 177.2600 - Rubber articles intended for repeated use have been found, through testing of a representative sample, to meet the extractives limitations in 21 CFR 177.2600(e) and/or (f). It is the responsibility of the user to determine that the final
product complies with the extractive limitations and other requirements of 21 CFR 177.2600 under their specific manufacturing procedures.
NOTE: Typical properties are average data and are not to be used as or to develop specifications.
.jpg)
Technical Documents
Featured Products
INVISISIL™ AM2211 OLED Silicone Encapsulant
Learn more about our INVISISIL™ AM2211 OLED encapsulant is a high purity and low-volatile-outgas silicone material that requires only mild thermal cure.
View Product View Product LiteratureFRV1106 Silicone Adhesive Sealant
Learn more about FRV1106 adhesive sealant, our one-component fluorosilicone sealant that cures to tough silicone rubber.
View Product Download Technical Data View Product LiteratureINVISISIL™ AM4911 OLED Encapsulant
INVISISIL™ AM4911 | OLED Encapsulant | Momentive.com™ Learn more about INVISISIL* AM4911 OLED encapsulant, a high-purity silicone material that is used to prevent overflow during screen printing and dispensing.
View Product View Product LiteratureINVISISIL™ IVS9520 Transparent Silicone
Learn more about INVISISIL IVS9520 transparent silicone rubber, an excellent surface mount & silicone adhesive, also providing UV and temperature stability
View Product Download Technical Data View Product LiteratureINVISISIL™ IVSD3208
INVISISIL IVSD3208 dam material is an excellent candidate for forming the dam shape in multi-array LED modules. Learn More.
View Product Download Technical Data View Product Literature