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SILCOOL™ TIA225GFB-25 Liquid-Dispensed Thermal PAD/Gap Filler
SILCOOL TIA225GFB-25 gap filler is a 2-component, soft, thermally conductive silicone material that can help to dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for better optimized processing. TIA225GFB-25 gap filler can be used as liquid-dispensed alternative to pre-fabricated thermal pads, for a broad array of thermal designs in electronic applications.
More About SILCOOL™ TIA225GFB-25 Liquid-Dispensed Thermal PAD/Gap Filler
Key Features and Typical Benefits
- Good thermal conductivity
- Faster, low-temperature cure
- Retains softness after cure to enhance stress relief during thermal cycling
- Easy to use 1:1 mixing ratio
- Conforms to complex shapes of three-dimensional interface designs
- Repairable
- Flame retardant: UL94V-0 equivalent
- Glass beads for bond line thickness (BLT) control (250μ)
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*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
