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Thermal Management Solutions for Automotive Electronics Products

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SilCool™ TIA241GF Silicone Gap FIller

Learn more about SilCool* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

SilCool™ TIA350R Adhesive

Learn more about SilCool TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

SnapSil™ TN3085

SnapSil TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature

TIA225GF Liquid-Dispensed Silicone Thermal Pad

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer

XE11-B5320

XE11-B5320 is a one-component, low volatile paste, alkoxy cure, thermally conductive silicone adhesive sealant.

SilCool™ TIA235G
New From Momentive
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.