Thermal Management Solutions for Automotive Electronics Products
Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.
Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.
SNAPSIL TN3085 is a one-component, thermally conductive, low volatile siloxane, silicone adhesive that cures at room temperature
TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer
XE11-B5320 is a one-component, low volatile paste, alkoxy cure, thermally conductive silicone adhesive sealant.
New From Momentive
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
