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Thermally Conductive Encapsulants and Potting Compounds
Back to Thermal Management Silicones
Momentive Performance Materials’ silicone encapsulants offer thermal conductive performance that can enhance the long-term reliability of heat-generating electronic components. These thermal products cure to a soft rubber, gel material, and include low viscosity grades that can be used for potting applications, and higher viscosity grades that exhibit dispensing stability needed for bead formulation. Some products are also candidates as gap fillers or liquid-dispensed alternatives to thermal pads.
Product Details
| Properties | TIA222G | TIA216G | TIA208R | |
|---|---|---|---|---|
| Features | High thermal conductivity, tacky adhesion, fast head and R/T cure | Low viscosity, tacky adhesion, fast head and R/T cure | Low viscosity, primerless adhesion, fast head and R/T cure | |
| Type | 2 part | 2 part | 2 part | |
| Property (uncured) | Flowable | Flowable | Flowable | |
| Color | Gray | Gray | Black | |
| Mixing Ratio ((A):(B) by weight) | 100:100 | 100:000 | 100:100 | |
| Workable Life (23°C) | h | 4 | 0.5 | 1.5 |
| Viscosity (23°C) | Pa.s | 20 | 8 | 4.5 |
| Cure Condition (heat) | °C/h | 70/0.5 | 70/0.5 | 70/0.5 |
| Cure Condition (room temp) | h | 24 | 6 | 24 |
| Thermal Conductivity1 | W/m.K | 2.2 | 1.6 | 0.7 |
| Specific Gravity (23°C) | 2.81 | 2.69 | 1.6 | |
| Hardness (Type E) | 45 | 45 | 40 (type A) | |
| Adhesion Strength (AI) | Mpa | - | - | 1.2 |
| Adhesion Strength (PC) | Mpa | - | - | 0.7 |
| CTE | ppm/K | 140 | 150 | - |
| Volume Resistivity | MΩ.m | 4.8x106 | 4.8x106 | 2.0x106 |
| Dielectric Strength | kV/mm | 20 | 18 | 27 |
| Volatile Siloxane (D4-D10) | ppm | <200 | <200 | - |
| Flame Retardancy | UL94 V-0 | UL94 V-0 | UL94 V-0 |
1Hot wire method *planned Typical property data values should not be used as specifications
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
