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SILCOOL™ TIA211G Thermally Conductive Potting Material
SILCOOL TIA211G is a 2-component, thermally conductive potting material. Its lower viscosity allows the material to conform to intricate shapes of thermal interfaces and contributes to the reduction of contact interference in complex designs. TIA211G quickly cures to a soft rubber gel with exposure to heat, and retains tacky adhesion on its cured surface.
More About SILCOOL™ TIA211G Thermally Conductive Potting Material
Key Features and Typical Benefits
- Good thermal conductivity
- Low specific gravity
- Lower viscosity: Pours easily, penetrates complex assemblies
- Fast cure with exposure to heat (50°C)
- Cures at room temperature
- Easy to use 1:1 mixing ratio by weight or volume
- Absorbs shock and protects delicate mechanical components from vibration.
- Hot and cold temperature resistance, enabling use in operating temperature ranges of -40~150°C.
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
