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Thermal Management Silicones for Electronics Products

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SILCOOL™ TIA241GF Silicone Gap FIller

Learn more about SILCOOL* TIA241GF, a 2-component, thermally conductive silicone for dissipating heat in your electronics applications.

SILCOOL™ TIA350R Adhesive

Learn more about SILCOOL TIA 350R Adhesive, an excellent candidate to consider for applications that require removing heat from heat-generating components.

SILCOOL™ TIG210BX Silicone Compound

SILCOOL* TIG210BX silicone compound are used in electronics and other applications where high thermal conductivity and low oil bleed are required. Learn more.

SILCOOL™ TIA216G Thermally Conductive Silicone Rubber

SILCOOL TIA216G is a 2-component, thermally conductive potting material used primarily on complex thermal interface designs.

SILCOOL™ TIG3500H Thermally Conductive Silicone Compound

SILCOOL™ TIG4070 Thermally Conductive Silicone Compound

SILCOOL™ TIG4090 Thermally Conductive Silicone Compound

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.