Ultra-High Thermal Gap Fillers

Faster processing speeds, more stringent performance requirements, and miniaturization in many electronic applications are some of the factors driving demand for new solutions to help meet thermal management challenges. Momentive’s SilCool* ultra-high thermally conductive gap fillers are liquid dispensed silicone materials available in thermal conductivities up to 10 W/m.K. These high thermal conductivities can help solve heat dissipation challenges and provide designers of electronic components with greater design flexibility to achieve performance expectations.