High-Performance Thermally Conductive Silicone Gap Fillers

Momentive’s thermally conductive silicone gap fillers are dispensed to fill air gaps and voids in electronic components. They work with heat sinks or metal cases to dissipate heat from critical electronic parts. These non-adhesive curing silicones form a soft, stress-absorbing interface and fill uneven areas to improve cooling.

Our thermal gap fillers can also be applied to flat or high-profile 3-dimensional surfaces as a cure-in-place thermal pad or as a pump-out resistant alternative to greases.

These high performance thermal gap fillers are designed with performance and supply reliability in mind. Momentive owns our own globally dispersed production facilities. We control our manufacturing process from the base silicone all the way through to the finished product. This ensures you get the performance you need along with full quality control over all inputs as well as the finished product.

Key Features of Momentive's Thermal Gap Fillers

• Good thermal conductivity
• Fast, low temperature cure
• Helps provide stress relief during thermal cycling
• Conforms to complex, 3-dimensional designs
• Non-adhesive, repairable