TIA225GF Liquid-Dispensed Silicone Thermal Pad
TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.
TIA225GF Liquid-Dispensed Silicone Thermal Pad の詳細
Key Features and Typical Benefits
- Good thermal conductivity
- Fast low-temperature cure
- Retains softness after cure to enhance stress relief during thermal cycling
- Easy to use 1:1 mixing ratio
- Conforms to complex shapes of three-dimensional interface designs
- Can be dispensed or printed
- Repairable Flame retardant: UL94V-0 equivalent
詳細: 自動車エレクトロニクス用シリコーン Old
業種を表示する * Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
