Working as a trimethoxy silane, Silquest A-187 silane bonds to inorganic substrates to provide excellent wet and dry adhesion along with a rapid hydrolysis rate. Silquest A-187 silane also demonstrates enhanced electrical properties in epoxy-based encapsulants and packaging materials, the result of improved bonding between resin and substrate or filler. Formulated to enhance wet adhesion, Silquest A-187 silane also benefits epoxy encapsulation systems through its enhanced safety of semiconductor or integrated circuits, which it guards from water ingress or surface corrosion.

This silane is also an excellent candidate for waterborne applications, including acrylic and vinyl-acrylic caulks, as well as urethane and latex caulk applications, where it can improve adhesion to glass and metal substrates.

Other epoxy applications that may benefit from the addition of Silquest A-187 silane include quartz-filled epoxy encapsulants, pre-mix formulations and sand-filled epoxy concrete patching materials, along with metal-filled epoxy, like those used in mold and dye tools.

For key features, typical benefits and physical properties, potential applications and more, please download the marketing bulletin on this page.

*Silquest A-187 and SPUR ⁺ are trademarks of Momentive Performance Materials Inc.