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TIA225GF Liquid-Dispensed Silicone Thermal Pad

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TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components. 

Description

Key Features and Typical Benefits

  • Good thermal conductivity
  • Fast low-temperature cure
  • Retains softness after cure to enhance stress relief during thermal cycling
  • Easy to use 1:1 mixing ratio
  • Conforms to complex shapes of three-dimensional interface designs
  • Can be dispensed or printed
  • Repairable Flame retardant: UL94V-0 equivalent
Safety Data Sheet
Safety Data Sheet
Technical Data Sheet
TIA225GF Liquid-Dispensed Silicone Thermal Pad Technical Data Sheet

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