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SILCOOL™ TIA211G Thermally Conductive Potting Material

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SILCOOL TIA211G is a 2-component, thermally conductive potting material. Its lower viscosity allows the material to conform to intricate shapes of thermal interfaces and contributes to the reduction of contact interference in complex designs. TIA211G quickly cures to a soft rubber gel with exposure to heat, and retains tacky adhesion on its cured surface.

Description

Key Features and Typical Benefits

Good thermal conductivity
Low specific gravity
Lower viscosity: Pours easily, penetrates complex assemblies
Fast cure with exposure to heat (50°C)
Cures at room temperature
Easy to use 1:1 mixing ratio by weight or volume
Absorbs shock and protects delicate mechanical components from vibration.
Hot and cold temperature resistance, enabling use in operating temperature ranges of -40~150°C.

Safety Data Sheet

Technical Data Sheet

SILCOOL™ TIA211G Thermally Conductive Potting Material Technical Data Sheet

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SILCOOL™ TIA211G Thermally Conductive Potting Material

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