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SILCOOL™ TIA208RL Thermally Conductive Silicone Potting

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SILCOOL TIA208RL is a two-component, thermally conductive material for potting. The flowability of TIA208RL allows it to be potted and conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat. TIA208RL can be cured at room temperature or quickly with heat.

SILCOOL TIA208RL is a two-component, thermally conductive material for potting. The flowability of TIA208RL allows it to be potted and conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.  TIA208RL can be cured at room temperature or quickly with heat.

Key Features and Typical Benefits

  • Very low viscosity for flow into complex cavities
  • Good thermal conductivity
  • Easy to use 1:1 mixing ratio
  • Cures and adheres quickly with heat or at room temperature
  • UL94V-0 certified (E-File E320603)

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*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.