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Thermal Solventless RLC

SilForce™ Thermal Solventless Release Coatings for Clear Films and Specialty Uses

Thermal addition-cure (Pt) and condensation-cure (Sn) solvent-based release coatings are widely utilized on clear films that demand optical clarity and compatibility with high-performance adhesives. These coatings find applications in industries such as graphics, tape manufacturing, aerospace, and medical sectors, particularly where embossing capabilities are necessary or where solvent-based adhesives are prevalent.

Momentive’s SilForce™ SS silicone release coatings are tailored depending on the curing mechanism, incorporating base and controlled release polymers, inhibitors, accelerators, catalysts, and crosslinkers. They excel with various coating methods including gravure, reverse roll, knife, and wire rod.

Key Features and Benefits of SilForce™ Thermal Solventless Release Coatings

  • Addition-cure and condensation-cure capabilities
  • Exceptional optical clarity
  • Strong anchorage on filmic substrates
  • Low coat weights and coefficient of friction (COF)
  • Embossing capability for condensation-cured (Sn) systems, facilitating air egress
  • Effective application with gravure, reverse roll, knife, and wire rod methods
  • Broad compatibility with adhesives and substrates for condensation-cured (Sn) systems
 

Explore our range of products in the Thermal Solventless Silicone Release Coatings category:

  • Thermal Solventless Addition-Cure (Pt) Systems Products
  • Thermal Solventless Condensation-Cure (Sn) Systems Products

You can also reach out to our dedicated experts to craft a tailored release coating formulation that precisely matches your process requirements, substrate characteristics, adhesive specifications, and release demands.

Thermal  Solventless adhesive application