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Thermal Gap Filler Liquid Dispensed Pad
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Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they are also applied to flat or high-profile 3-dimentional surfaces as a cure-in-place thermal pad or as a pump-out resistant alternative to greases.
Key Features and Typical Benefits of Momentive's Thermal Gap Fillers
- Good thermal conductivity
- Fast, low temperature cure
- Stress relief during thermal cycling
- Conforms to complex, 3-dimensional designs
- Non-adhesiveness, repairability
Product Details
| Properties | TIS420C | TIA225F | TIA241GF | |
|---|---|---|---|---|
| Mixing Ratio ((A):(B) by weight) | - | 100:100 | 100:100 | |
| Property (uncured) | Non-Flowable | Non-Flowable | Non-Flowable | |
| Color | Gray | Gray | Blue | |
| Viscosity (23°C) | Pa.s | 300 | 90 | 130 |
| Workable Life (23°C) | h | - | 4 | 3 |
| Tack Free Time | min | 10 | - | - |
| Cure Condition (heat) | °C/h | - | 70/0.5 | 70/0.5 |
| Specific Gravity (23°C) | 3.2 | 2.9 | 3.14 | |
| Thermal Conductivity1 | W/m.K | 4.2 | 2.5 | 4.1 |
| Thermal Resistance2 (BLT) | mm2.K/W | 20 (50μm) | 35 (50μm) | 30 (80μm) |
| Volume Resistivity | MΩ.m | 3.0x103 | 6.0x106 | 1.0x104 |
| Volatile Siloxane (D4-D10) | ppm | 100 | 200 | 150 |
1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material
Typical property data values should not be used as specifications
* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
