Thermally Conductive Silicone Adhesives

Back to Thermal Management Silicones


Momentive Performance Materials developed its family of SilCool thermally conductive adhesives to help deliver thin bond lines, which contribute to low thermal resistance while providing excellent adhesion and reliability. This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.

Additional thermal adhesives from Momentive offer the process convenience of 1-Part condensation cure with moderate heat dissipation. Target applications include board assemblies and sealants in power modules and sensors.

SilCool* Silicone Adhesive - Addition Cure

The SilCool series silicone adhesives from Momentive Performance Materials offer 1-Part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They help deliver outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are excellent candidates for addressing the heat management challenges arising from the higher frequencies, power, and miniaturization in today’s electronic devices. Designed to efficiently conduct heat, these materials are valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).

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Key Features

  • Highly workable – excels in automated dispensing, screen printing, and stamping applications
  • Fast cure & good adhesion
  • High thermal conductivity
  • Low thermal resistance
  • Wide operating temperature range
  • Compatible with high-temperature lead-free processing
  • Minimal ionic impurities & excellent dielectric properties

Product Details

Properties   TIA600R TIA350R TIA260R XE13-C1862PT TSE3281-G
Features   High thermal conductivity, strong adhesion High thermal conductivity, low temperature fast cure Good thermal conductivity, low temperature fast cure Good thermal conductivity, high elongation -
Type   1 part 1 part 1 part 1 part 1 part
Property (uncured) Flowable Flowable Flowable Flowable Flowable
Color Gray Gray Gray Gray Gray
Viscosity (23°C) Pa.s 130 67 70 55 60
Cure Condition °C/h 150/1 120/0.5 120/0.5 150/1 150/1
Thermal Conductivity2 W/m.K 6.0 3.5 2.5 2.5 1.7
Thermal Resistance2 (BLT) mm2.K/W 11 (50μm) 24 (60μm) 25 (50μm) 25 (50μm) 35 (50μm)
Specific Gravity (23°C)   3.44 3.1 2.89 2.87 2.70
Hardness (Type A)   95 77 55 65 84
Tensile Strength Mpa 7.0 1.6 1.1 1.5 4.5
Elongation % 10 20 40 80 50
Adhesion (Al lap shear) MPa 5.4 (Ni/Ni) 1.0 0.8 1.0 2.5
CTE ppm/K 90 115 130 130 140
Glass Transition Temp. °C -120 -120 -120 -120 -120
Volume Resistivity MΩ.m 4.8x106 4.8x106 4.8x106 4.8x106 4.8x106
Dielectric Strength kV/mm 20 20 20 20 15
Volatile Siloxane (D4-D10) ppm <100 <150 <200 <200 -
Ionic Content3 (Na+/K+/Cl-) ppm each <5 each <5 each <5 each <5 each <10
Moisture Absorption wt% <0.6 <0.6 <0.6 <0.6 <0.6

1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material, 3Ion chromotography analysis on water extracts *4 Impressed voltage: 100V Typical property data values should not be used as specifications

(Charts) Thermal Resistance is proportional to the thickness of the material through which the heat must travel. Increases in pressure during the component assembly process are known to contribute to reductions in thickness of the thermal interface (BLT), and subsequently, reduced thermal resistance.

thermal-adhesives-2-initial-properties

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, and cure for 1 hour at 150°C. Measure thermal resistance using laser flash method.

thermal-adhesive-3-thermal-shock-reliability

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, assemble at 500kPa and cure at 150°C for 1 hour. Thermal cycle (-55°C~150°C, dwell time 30 minutes at each extreme). Measure thermal resistance using laser flash method.

thermal-adhesive-4-silcool-adhesive-temperature-humidity-reliability

(Above) Test Conditions: Sandwich material between 10mm×10mm silicon dies, assemble at 500kPa and cure at 150oC for 1 hour. High temperature / humidity test (85°C, 85%RH, 250, 500, 750, 1000 hours). Measure thermal resistance using laser flash method.

Silicone Adhesive - Condensation Cure

Momentive Performance Materials offers a range of condensation cure adhesives and sealants that deliver thermal conductive performance. These materials cure to form an elastic rubber when exposed to atmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is a unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.

Product Details

Properties   TIA0260 TIA0220 XE11-B5320
Features   High thermal conductivity, strong adhesion High thermal conductivity, strong adhesion Fast tack free time, UL certified
Type   1 part 1 part 1 part
Property (uncured) Semi-Flowable Semi-Flowable Semi-Flowable
Color Light Gray Gray White
Viscosity (23°C) Pa.s 150 300 -
Tack Free Time min 10 10 5
Thermal Conductivity1 W/m.K 2.6 2.2 1.3
Thermal Resistance2 (BLT) mm2.K/W 18 (50μm) 25 (50μm) 35 (50μm)
Specific Gravity (23°C)   3.01 2.87 2.59
Hardness (Type A)   90 88 80
Tensile Strength Mpa 4.8 5.2 3.6
Elongation % 20 40 40
Adhesive Strength MPa 3.0 4.2 1.3
CTE ppm/K 100 110 120
Glass Transition Temp. °C -120 -120 -120
Volume Resistivity MΩ.m 7.0x106 1.0x107 2.0x107
Dielectric Strength kV/mm 20 20 17
Volatile Siloxane (D4-D10) ppm 10 20 100
Flame Retardancy UL94 HB

1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material Typical property data values should not be used as specifications

thermal-adhesive-5-initial-properties

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.