Thermally Conductive Encapsulants and Potting Compounds

Back to Thermal Management Silicones


Momentive Performance Materials’ silicone encapsulants deliver thermal conductive performance, contributing to the long-term reliability of heat-generating electronic components. These thermal products cure to a soft rubber, gel material, and include low viscosity grades that can be used for potting applications, and higher viscosity grades that exhibit dispensing stability needed for bead formulation. Some products are also candidates as gap fillers or liquid dispensed alternatives to thermal pads.

Product Details

Properties   TIA222G TIA216G TIA208R
Features   High thermal conductivity, tacky adhesion, fast head and R/T cure Low viscosity, tacky adhesion, fast head and R/T cure Low viscosity, primerless adhesion, fast head and R/T cure
Type   2 part 2 part 2 part
Property (uncured) Flowable Flowable Flowable
Color Gray Gray Black
Mixing Ratio ((A):(B) by weight)   100:100 100:000 100:100
Workable Life (23°C) h 4 0.5 1.5
Viscosity (23°C) Pa.s 20 8 4.5
Cure Condition (heat) °C/h 70/0.5 70/0.5 70/0.5
Cure Condition (room temp) h 24 6 24
Thermal Conductivity1 W/m.K 2.2 1.6 0.7
Specific Gravity (23°C)   2.81 2.69 1.6
Hardness (Type E)   45 45 40 (type A)
Adhesion Strength (AI) Mpa - - 1.2
Adhesion Strength (PC) Mpa - - 0.7
CTE ppm/K 140 150 -
Volume Resistivity MΩ.m 4.8x106 4.8x106 2.0x106
Dielectric Strength kV/mm 20 18 27
Volatile Siloxane (D4-D10) ppm <200 <200 -
Flame Retardancy   UL94 V-0 UL94 V-0 UL94 V-0

1Hot wire method *planned Typical property data values should not be used as specifications

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.