Low Outgassing Silicone RTVs

ASTM E595 Compliant Pastes Adhesives

Momentive has a full range of advanced low outgassing silicone products that offer outstanding performance with minimal by-products, and meet low outgassing requirements for adhesives in crew capsules and satellites.

Our low outgassing silicones are resistant to extreme temperatures, friction, abrasion and stress, and can provide protection against corrosives, water, oils and salts. They meet or exceed ASTM E595 testing standards established by NASA and the European Space Agency (ESA).

Potential Applications for Momentive’s Low Outgassing RTV Silicones include:

• Solar arrays and optical equipment sealing
• Cast in place heat shielding
• Crew capsule applications
• Thermal insulation of sensitive components
• Protective coatings for critical equipment
• Encapsulants & potting for high heat locations
• Interior & exterior adhesives
• Flexible composite coatings

Key Features and Potential/Typical Applications of Momentive’s Low Outgassing Silicone RTVs 

• RTV 566 Paste
  • Red, two-component paste with excellent release and wide temperature performance capabilities
  • Potential applications include cast-in-place heat shielding, thermal insulation, potting, encapsulating electrical assemblies and assembly of photovoltaic (PV) modules.
  • Outstanding adhesion with a primer at low temperatures
  • Room temperature cure with variable cure rates
  • Wide useful temperature range of -115°C (-175°F) to 260°C (500°F) continuously and up to 316°C (600°F) for short periods of time.
• RTV 567 Low Temperature Adhesive
  • Translucent, two-component flowable adhesive with excellent release properties
  • Potential applications include potting and encapsulating electrical assemblies and critical components.
  • Useful temperature range of -115°C (-175°F) to 205°C (400°F)
• RTV142 and RTV142C Paste Adhesives
  • White and translucent, one-component thixotropic paste adhesives.
  • Primer-less adhesion
  • Used for general adhesion and gasketing, sealing and bonding applications.
  • Useful temperature range of -60°C (-75°F) to 205°C (400°F)
• RTV577LV Paste
  • White, two-component thixotropic paste with excellent release capabilities and variable work and cure times through catalyst options
  • Potential applications include cast-in-place heat shielding, thermal insulation and potting and encapsulating of electrical assemblies.
  • Useful temperature range of -115°C (-175°F) to 205°C (400°F)
• LTR395LV Paste
  •  Gray, one-component, thermally conductive and electrically insulative paste
  • Typically used as a thermal interface material (TIM), adhesive and for gap filling.
  • Thermal conductivity of 3W/mk.
  • Useful temperature range of -40°C (-40°F) to 150°C (302°F)
• LTR495LV Paste
  • Blue, two-component, paste that is thermally conductive and flame retardant
  • Typically used as a thermal interface material
  • Gap filling with a 4 W/mK thermal conductivity.
  • Useful temperature range of -40°C (-40°F) to 150°C (302°F)