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SilCool* TIG210BX Silicone Compound

High Thermal Conductivity, Low Bleed

SilCool TIG210BX silicone compound from Momentive can provide high thermal conductivity while exhibiting virtually no oil separation and minimal weight loss at elevated temperatures. These attributes generally help contribute to the stability of the TIM interface under broad operational temperature ranges.

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  • Technical Documents

Thermal Management Silicones for Electronics Brochure
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More About SilCool* TIG210BX Silicone Compound

SilCool TIG210BX silicone compound may be used in a wide array of applications, from circuit board assembly, electronics manufacturing and flat-panel displays to optoelectronics, power supply operations, semiconductors and telecommunications.  

Key features and typical benefits generally also include low oil bleed, minimal ionic impurities and the potential for wide operating temperatures. These characteristics can help make SilCool TIG210BX silicone compound an excellent candidate to consider in components for industries including consumer electronics, energy, power and utilities, health care, and microelectronics.

Potential applications for SilCool TIG210BX silicone compound include:

  • Semiconductors
  • Circuit board assembly
  • Optoelectronics
  • Flat-panel displays

* SilCool is a trademark of Momentive Performance Materials Inc.

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*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.