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1-800-295-2392 or click below to call one of our regional representatives. Call Regional Customer Service Representative

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SilCool* TIA241GF

SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping, pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to prefabricated thermal pads in a broad array of thermal designs for electronic applications.

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  • Technical Documents

More About SilCool* TIA241GF

Key Features & Typical Benefits

  • Good thermal conductivity
  • Fast, low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retained softness after cure for enhanced stress relief during thermal cycling
  • Excellent slump resistance (stays in place)
  • Repairability
  • Flame retardancy: UL94V-0 equivalent
  • Glass bead options available (180 & 250μm) for bond line thickness (BLT) control

Potential Applications

Thermal interface for electronic components in automotive, consumer, telecommunication, lighting and industrial applications.

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* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.