SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

FOR HIGHER THERMAL CONDUCTIVITY

Formulated as a one-part neutral alkoxy curing adhesive with a high thermal conductivity level of 2.2 W/mK, SilCool TIA0220 neutral alkoxy cure adhesive is an excellent candidate to consider for applications that require more heat to be drawn away from sensitive electronics. 

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Silicone Materials for Electronic Devices and Component Assemblies Brochure
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More About SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

SilCool TIA0220 neutral alkoxy cure adhesive typically cures at room temperature, making it a candidate for applications that require a high level of thermal conductivity, yet cannot employ a heating process for curing. Formulated to generally offer noncorrosive adhesion to highly thermal, electrically conductive metals like copper, and a candidate to consider with plastics, ceramics and glass, this semiflowable gray paste is designed to be used across a wide operating temperature range without requiring a primer.

Potential applications for SilCool TIA0220 neutral alkoxy cure adhesive include: 

  • Heat spreaders
  • Board level component assembly

* SilCool is a trademark of Momentive Performance Materials Inc.

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*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.