Thermal Management Adhesives

Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. Designers confronting these challenges will find a range of solutions from Momentive’s line of silicone products. Our SilCool*   family of adhesives and compounds can deliver the high-thermal conductivity, thin bond lines, and low thermal resistance required for high-performance components. This series of heat-cured adhesives has excelled in thermal interface applications that demand good structural adhesion.  Examples include spreaders and heat generators, and thermal interface to heat sinks in TIM2 applications.

For applications requiring moderate level thermal management, Momentive offers a selection of standard-grade silicone adhesives, encapsulants, and potting materials. 

Additional thermal adhesives from Momentive offer the process convenience of 1-Part condensation cure with moderate heat dissipation.  Target applications include board assemblies and sealants in power modules and sensors. 

 

*SilCool is a trademark of Momentive Performance Materials Inc.

 

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.