X

Cookie Policy:

Momentive uses cookies to help improve your experience on our website. By using our website, you agree to our use of cookies. For more information, review our Privacy Policy.

You enabled cookies which provides the best site experience. To turn them off, please see our Cookie Policy and Privacy Pledge .

SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

For Higher Thermal Conductivity

Formulated as a one-part neutral alkoxy curing adhesive with a high thermal conductivity level of 2.2 W/mK, SilCool TIA0220 neutral alkoxy cure adhesive is an excellent candidate to consider for applications that require more heat to be drawn away from sensitive electronics. 

+
  • Technical Documents

Silicone Materials for Electronic Devices and Component Assemblies Brochure
Download

More About SilCool* TIA0220 Neutral Alkoxy Cure Adhesive

SilCool TIA0220 neutral alkoxy cure adhesive typically cures at room temperature, making it a candidate for applications that require a high level of thermal conductivity, yet cannot employ a heating process for curing. Formulated to generally offer noncorrosive adhesion to highly thermal, electrically conductive metals like copper, and a candidate to consider with plastics, ceramics and glass, this semiflowable gray paste is designed to be used across a wide operating temperature range without requiring a primer.

Potential applications for SilCool TIA0220 neutral alkoxy cure adhesive include: 

  • Heat spreaders
  • Board level component assembly

* SilCool is a trademark of Momentive Performance Materials Inc.

 

Explore: SilCool
View Brand
Explore: Transportation and Aerospace
View Industry

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.