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What is the purpose of your visit today?
If you need immediate assistance, please call
1-800-295-2392 or click below to call one of our regional representatives. Call Regional Customer Service Representative
Click here to view our privacy policy
SILCOOL TIA225GFB-25 gap filler is a 2-component, soft, thermally conductive silicone material that can help to dissipate heat from electronic devices. Its non-slumping pasty consistency can provide physical stability for better optimized processing. TIA225GFB-25 gap filler can be used as liquid-dispensed alternative to pre-fabricated thermal pads, for a broad array of thermal designs in electronic applications.
Key Features and Typical Benefits
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.