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Technical Data Sheet

 

Re-issued September 2005

 

 

EPON™ Resin 828

 

 

Product Description

EPON™ Resin 828 is an undiluted clear difunctional bisphenol A/epichlorohydrin derived liquid epoxy resin. When cross-linked or hardened with appropriate curing agents, very good mechanical, adhesive, dielectric and chemical resistance properties are obtained. Because of this versatility, EPON Resin 828 has become a standard epoxy resin used in formulation, fabrication and fusion technology.

 

Benefits

  • Fiber reinforced pipes, tanks and composites
  • Tooling, casting and molding compounds
  • Construction, electrical and aerospace adhesives
  • High solids/low VOC maintenance and marine coatings
  • Electrical encapsulations and laminates
  • Chemical resistant tank linings, flooring and grouts
  • Base resin for epoxy fusion technology

 

Sales Specification

Property

Units

Value

Test Method/Standard

Weight per Epoxide

g/eq

185 – 192

ASTM D1652

Viscosity at 25°C

P

110 – 150

ASTM D445

Color

Gardner

1 max.

ASTM D1544

 

 

 

 

 

Typical Properties

Property

Units

Value

Test Method/Standard

Density at 25°C

lb/gal

9.7

ASTM D1475

Denisty at 25°C

g/ml

1.16

 

Vapor pressure @ 25°C (77°F)

mm Hg

0.03

 

Refractive index @ 25°C (77°F)

 

1.573

 

Specific heat

BTU/lb/°F

0.5

 

 

 

 

 

 


Processing/How to use

 

General Information

The low viscosity and cure properties of EPON Resin 828 allow its use under various application and fabrication techniques including:

  • Spraying and brushing
  • Pultrusion
  • Filament winding
  • Casting
  • Pressure laminating
  • Molding
  • Vacuum bag laminating
  • Toweling

 

Curing Agents

EPON Resin 828 can be cured or cross-linked with a variety of curing agents depending on properties desired in the finished product and the processing conditions employed. Some commonly used curing agents, recommended concentrations, typical cure schedules employed in major end-use applications, plus sources for these curing agents are displayed in Table 1.

 

Performance Properties

Perfomance Characteristics of Cured EPON Resin 828

Mechanical Properties

High performance, high strength materials are obtained when this resin is cured with a variety of curing agents. Unfilled systems in common use have tensile values greater than 10,000 psi (69 MPa) with modulus values greater than 400,000 psi (2750 MPa). Such systems are normally very rigid. If greater flexibility is needed systems can be formulated to provide up to 300% elongation.

 

Adhesive Properties

One of the most widely recognized properties of cured EPON Resin 828 is strong adhesion to a broad range of substrates. Such systems exhibit shear strength of up to 6,000 psi (41 Mpa). One factor which contributes to this property is the low shrinkage shown by these systems during cure. Compared to other polymers, epoxy resins have low internal stresses resulting in strong and durable finished products.

 

Electrical Properties

EPON Resin 828 cured systems have very good electrical insulating characteristics and dielectric properties. For example, systems can be obtained with anhydride and amine curing agents having volume resistivities up to 1 x 10E16 ohm-cm, dielectric constants of 3-5 and dissipation factors of 0.002 to 0.020 at ambient conditions. Electrical encapsulations, laminates and molding compounds are frequently based on EPON Resin 828.

 

Chemical Resistance

Cured EPON Resin 828 is highly resistant to a broad range of chemicals, including caustic, acids, fuels and solvents. Chemically resistant reinforced structures and linings or coatings over metal can be formulated with EPON Resin 828.

 

Formulating Techniques

The primary components of a thermosetting resin formula are the epoxy resin and the hardener or curing agent. However, in practice other materials are normally incorporated to achieve special properties. For example, inert fillers such as silicas, talcs, calcium silicates, micas, clays and calcium carbonate can be added to further reduce shrinkage and improve dimensional stability. Also, reactive diluents can be added to EPON Resin 828 to reduce viscosity. The effect on viscosity by adding such materials is shown in Figure 1.

 

 

Table 1 / Curing Agents for EPON™ 828

 

 

 

Curing Agent1

 

 

PhysicalState

RecommendedConcentration

Range, phr2

Typical Cure Schedule Time

°C (°F)

Deflection Temperature

3°C (°F)

 

 

Applications4

 

 

Suppliers5

 

 

 

 

 

 

 

Aliphatic Amines

 

 

 

 

 

 

EPIKURE™ 3223 (DETA)

Liquid

12

7d, 25(77)

120(250)

ABCDEFHI

5

EPIKURE 3234 (TETA)

Liquid

13

7d, 25(77)

120(250)

ABCDEFHI

5

EPIKURE 3200 (AEP)

Liquid

22

24h, 25(77) &

1h, 150(300)

120(250)

BCEFGH

5

EPIKURE 3270

Liquid

75

14d, 25(77)

56(133)

ABCDEFHI

5

EPIKURE 3271

Liquid

18

14d, 25(77)

66(151)

ABCDEFHI

5

EPIKURE 3274

Liquid

40

14d, 25(77)

---

ABCDEFHI

5

EPIKURE 3230

Liquid

35

7d, 25(77)

68(155)

ABCDEFHI

1

D-400 Type PEA

Liquid

55

30 min, 115(240)

31(88)

ABCEFH

1

 

 

 

 

 

 

 

Cycloaliphatic Amines

 

 

 

 

 

 

EPIKURE 3370

Liquid

38

7d, 25(77)

56(133)

ABCDEFHI

5

EPIKURE 3382

Liquid

63

7d, 25(77)

63(145)

ABCDEFHI

5

EPIKURE 3383

Liquid

60

24h, 25(77) &

2h, 100(212)

54(129)

ABCDEFHI

5

 

 

 

 

 

 

 

Polyamides

 

 

 

 

 

 

EPIKURE 3115

Liquid

120

1h, 100(212)

85(185)

AB

5

EPIKURE 3125

Liquid

90

7d, 25(77)

90(195)

ABCEFH

5

EPIKURE 3140

Liquid

75

7d, 25(77)

115(240)

ABCEFH

5

 

 

 

 

 

 

 

Amindoamines

 

 

 

 

 

 

EPIKURE 3015

Liquid

50

16h, 25(77) &

2h, 93(200)

---

ABCDEFHI

5

EPIKURE 3055

Liquid

50

16h, 25(77) &

2h, 93(200)

67(153)

ABCDEFHI

5

EPIKURE 3072

Liquid

35

14d, 25(77)

59(138)

ABCDEFHI

5

 

 

 

 

 

 

 

Aromatic Amines

 

 

 

 

 

 

EPIKURE W

Liquid

 

 

 

 

5

Metaphenylenediamine (MPDA)

Solid

14

2h, 80(175) &

2h, 150(300)

150(300)

BCDGHI

3

Methylene dianiline (MDA)

Solid

27

2h, 80(175) &

2h, 150(300)

160(320)

BCDEGHI

13

Diaminodiphenyl Sulfone (DADS)

Solid

25

5h, 125(257) &

1h, 200(392)

170(350)

BCDGHI

2, 13

 


 

Table 1 / Curing Agents for EPON™ 828, cont.

 

 

 

Curing Agent1

 

 

PhysicalState

RecommendedConcentration

Range, phr2

Typical Cure Schedule Time

°C (°F)

Deflection Temperature

3°C (°F)

 

 

Applications4

 

 

Suppliers5

 

 

 

 

 

 

 

Anhydrides

 

 

 

 

 

 

Methyl tetrahydrophthalic Anhydride (MTHPA)

Liquid

80

2h, 120(250) &

2h, 150(300)

130(266)

BCDGHI

9, 11, 14

NADIC Methyl

Anhydride (NMA)

Liquid

90

1h, 120(250) &

2-24h, 260(500)

180(356)

BCDGHI

9, 14

Hexahydrophthalic Anhydride (HHPA)

Solid

80

1h, 80(175) &

2h, 150(300)

130(265)

BCDGHI

8, 12, 14

 

 

 

 

 

 

 

Catalysts and Miscellaneous

 

 

 

 

 

 

2-Ethyl- 4-Methyl Imidazole (EMI-24)

Metastable Liquid

3

4h, 50(122) &

2h, 170(340)

170(340)

BCDGHI

15, 16

BF3-Monoethylamine

(BF3-MEA)

Liquid

3

1h, 120(250) &

2h, 170(340)

170(340)

BCDGHI

17

Diethylaminopropylamine 6

Solid

6

30 min, 115(240)

100(212)

ABC

6

Dicyandiamide

Solid

4

1h, 177(350)

150(300)

BCDGHI

18, 19

1 Cures can be effected with these curing agents over a wide range of temperatures. Higher temperatures yield shorter cure times and highest Tg.

2 Parts of curing agent per 100 parts of resin.

3 Systems cured at room temperature were post cured at elevated temperature to achieve deflection values.

4 Application codes: A - Coatings; B - Adhesives; C - Castings; D - Moldings; E - Flooring; F - Paving; G - Electrical Laminates; H - Structural Laminates; I-Filament Winding.

5 Supplier Code:

1. Huntsman Chemical

2. RSA Corporation

3. E.I. DuPont de Nemours &Co., Chemicals & Pigments Dept.

4. Harshaw Chemical Company

5. Momentive Specialty Chemical

6. BASF Corporation

7. American Cyanamid - Industrial Chemical Div.

8. Milliken & Company

9. Lindau Chemicals, Inc.

10. Anhydrides and Chemicals, Inc.

11. Dixie Chemical Co., Inc.

12. Buffalo Color Corp.

13. Air Products and Chemicals, Inc.

14. Lonza

15. Interchem

16. Polyorganix

17. Atotech

18. SKW Trotsbery

19. Ashland Chemical

6 Dimethylamino propylamine may be substituted at expense of slightly reduced pot life. Sources are 2 and 16.

 

Figure 1 / Viscosity at 25 °C of EPON™ Resin 828 blends with various diluents

 

EPON 828 Figure 1

 

 

Fusion Technology

EPON Resin 828 is the product of choice for a resin chemist using a specific fusion catalyst when processing proprietary solid epoxy resins or epoxy esters. Upon request, Momentive Specialty Chemicals can provide EPON Resin 828 exhibiting extremely low hydrolyzable and total chlorine, two end groups that may be deleterious to resin curing and long term performance in electrical uses.

 

FDA Status

Provisions are made in the FDA regulations for the use of EPON Resin 828, when properly formulated, applied and cured, for food contact applications under Title 21 Code of Federal Regulations 175.300. The regulations should be consulted for complete details. In particular, we direct your attention to subparagraph (b) of 21 CFR 174.5 and the general provisions applicable to indirect food additives listed there.

 

Identification and Classification

Chemical Abstract Service Registry Number: 25068-38-6 (EPA/TSCA inventory designation)

 

Generic name: Liquid Bisphenol A Epichlorohydrin based epoxy resin.

 

Chemical designation: Phenol, 4,4O - (1-methylethylidene) bis-polymer with (chloromethyl) oxirane.

 

Figure 2 / Viscosity - temperature profile for EPON™ Resin 828

 

EPON 828 Figure 2

 

 

Figure 3 / Specific gravity - temperature profile for EPON™ Resin 828

 

 

EPON 828 Figure 3

 

Formulation and Application Information

For additional performance characteristics information covering adhesives, laminating, casting and molding applications, consult bulletin SC:67, entitled "EPON Resin Structural Reference Manual." For epoxy resin amine-cured coatings, consult bulletin SC:193, entitled "Formulating Amine-Cured Coatings with EPON Resin."

 

Figure 4 / Viscosity - temperature profile (for 5 samples of EPON™ Resin 828 ranging in viscosity from 110-150 poise)

 

 

EPON 828 Figure 4


Safety, Storage & Handling

Please refer to the MSDS for the most current Safety and Handling information.

 

Please refer to the Momentive web site for Shelf Life and recommended Storage information.

 

EPON Resin 828 is an undiluted liquid epoxy resin that is available in tank cars, tank trucks and 500 pound net closed head drums. EPON Resin 828 is normally shipped in bulk from 150 °F (66 °C) to 180 °F (82 °C) and can be stored at 120-140 °F (49-60 °C) for ease of handling. The viscosity/temperature profile and the specific gravity/temperature profile for EPON Resin 828 are displayed in Figures 2 and 3 respectively for your guidance.

 

NOTE OF CAUTION: When checking viscosity of EPON Resin 828 incoming samples, we caution you to make certain that the product is maintained at 25 +/- 0.01 °C before testing. You will note in Figure 4 that EPON Resin 828 can vary in viscosity by 10-15 poise for each degree in temperature the product varies from 25 °C.

 

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Momentive Specialty Chemicals Inc. ("Momentive") products should be directed to your Momentive sales representative, or the nearest Momentive sales office. Information and MSDSs on non-Momentive products should be obtained from the respective manufacturer.

 

Packaging

Available in bulk and drum quantities.

 

 

Contact Information

For product prices, availability, or order placement, call our toll-free customer service number at:

1-877-859-2800

 

For literature and technical assistance, visit our website at: www.momentive.com

® and ™ Licensed trademarks of Momentive Specialty Chemicals Inc.

DISCLAIMER

The information provided herein was believed by Momentive Specialty Chemicals Inc. (“Momentive”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Momentive are subject to Momentive’s terms and conditions of sale. MOMENTIVE MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY MOMENTIVE, except that the product shall conform to Momentive’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

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