Momentive has developed a family of thermal materials based upon its high conductivity thermal pyrolytic graphite material.
TPG*
TPG (thermal pyrolytic graphite) is a unique form of pyrolytic graphite manufactured from thermal decomposition of hydrocarbon gas in a high temperature chemical vapordeposition reactor.
Benefits
- Thermal conductivity >4 times copper
- Lighter than aluminum
- Compatible with many encapsulating techniques
- Sizes from dies and packages to PWB’s
- Passive, high performance heat transfer
Features
- Highly oriented crystals in a layered structure
- In-plane conductivity typically >1500 watts/m-K
- Fully dense ceramic
- High c -direction modulus, contributing to improved section properties in composite structures
- Layered structure avoids brittle, catastrophic failure
- Easily machined, provided as plates or as final shapes
- Thickness ranges from less than 0.010" (0.25 mm) toover 0.200" (5 mm)
- Plate sizes up to 5" (125 mm) x 20" (500 mm)
- Special sizes can usually be provided upon request
TC1050*
TC1050 consists of a TPG core encapsulated within a structural shell. The TPG provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion).
Common Encapsulation Materials
- Aluminum (TC1050.Al)
- Copper (TC1050.Cu)
- Other encapsulations and systems are often available, such as kovar, tungsten/copper, carbon fiber composites, etc.
- The thermal expansion properties are defined by the selectionof the encapsulating material.
Benefits
- Thermal conductivity to 3 times copper
- Lighter than aluminum
- Adjustable coefficients of thermal expansion
- Low thermal resistance
- High reliability from passive conduction
- Sizes from diode mounts to whole chassis panels
*TPG and *TC1050 are trademarks of Momentive Performance Materials Inc.